科微学术

微生物学通报

微生物法降解木质素的研究进展
作者:
作者单位:

作者简介:

通讯作者:

中图分类号:

基金项目:

国家重点研发计划(2021YFD2200500);四川省“十四五”农作物及畜禽育种攻关计划(2021YFYZ0006)


Microbial degradation of lignin:a review
Author:
Affiliation:

Fund Project:

  • 摘要
  • |
  • 图/表
  • |
  • 访问统计
  • |
  • 参考文献
  • |
  • 相似文献
  • |
  • 引证文献
  • |
  • 资源附件
  • |
  • 文章评论
    摘要:

    生物质是代替石化资源生产能源和化学品的关键资源,木质素作为植物细胞壁的主要成分已经在很多行业中得到了广泛的应用。然而,由于木质素结构复杂且难以降解,成为生物质资源利用的最大障碍,因此,去除或者降解木质素是利用细胞壁中其他成分的关键步骤。许多行业使用有害化学物质降解木质素,严重危害了生态环境,自然界中木质素经常被包括真菌和细菌在内的微生物降解,因此,研究微生物降解木质素的机制为解决这一问题提供了可能性。本文讨论了木质素的化学组成成分,重点讨论了自然界降解木质素的微生物种类及其降解机制,包括各种真菌和细菌的木质素降解活性,描述了由各种微生物特别是白腐真菌、褐腐真菌和细菌产生的木质素降解酶,并展望了今后木质素生物降解的研究和应用的可能方向。

    Abstract:

    Lignocellulosic biomass represents a crucial resource for sustainable development by replacing petroleum-based production systems. Lignin, a major component of plant cell walls, has been widely used in many industries. However, it poses a challenge to the utilization of lignocellulosic biomass due to the recalcitrance and complex structure. Therefore, decomposition or removal of lignin is the key to the utilization of other cell wall components. Lignin is naturally degraded by many different species of microorganisms, including fungi and bacteria, and the mechanisms underlying the degradation of lignin by microorganisms provide a host of possibilities to overcome the challenges of using harmful chemicals to degrade lignin biowaste in many industries. This review discussed the chemical constituents of lignin, the lignin-degrading microbial species, such as fungi and bacteria, and the mechanisms, and the lignin-degrading enzymes produced by a variety of microorganisms, especially the white-rot fungi, brown-rot fungi, and bacteria. Finally, the possible trends of research and applications of lignin biodegradation were prospected.

    参考文献
    相似文献
    引证文献
引用本文

刘瑞,张丽,孙鹏,徐刚,曹颖,胡尚连,赵博. 微生物法降解木质素的研究进展[J]. 微生物学通报, 2023, 50(7): 3232-3244

复制
分享
文章指标
  • 点击次数:
  • 下载次数:
  • HTML阅读次数:
  • 引用次数:
历史
  • 收稿日期:2022-10-08
  • 最后修改日期:
  • 录用日期:2022-12-13
  • 在线发布日期: 2023-07-10
  • 出版日期: 2023-07-20
文章二维码